74LCX273MTC vs 74LVC273APG8 feature comparison

74LCX273MTC Texas Instruments

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74LVC273APG8 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Package Description TSSOP, TSSOP20,.25 TSSOP, TSSOP20,.25
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e0
Length 6.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max I(ol) 0.024 A 0.024 A
Number of Bits 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP20,.25 TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code TSSOP
Pin Count 20
Manufacturer Package Code PG20
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 20

Compare 74LCX273MTC with alternatives

Compare 74LVC273APG8 with alternatives