74LCX273FT
vs
74LVC273APG8
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
TSSOP, TSSOP20,.25
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Factory Lead Time |
53 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
6.5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
135000000 Hz
|
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
8
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP20,.25
|
TSSOP20,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Power Supply Current-Max (ICC) |
100 mA
|
|
| Prop. Delay@Nom-Sup |
9.5 ns
|
|
| Propagation Delay (tpd) |
33 ns
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
4.4 mm
|
|
| fmax-Min |
135 MHz
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
20
|
| Manufacturer Package Code |
|
PG20
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 74LCX273FT with alternatives
Compare 74LVC273APG8 with alternatives