74LCX157MX vs TC74LCX157FS-EL feature comparison

74LCX157MX Fairchild Semiconductor Corporation

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TC74LCX157FS-EL Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description 0.150 INCH, MS-012, SOIC-16 LSSOP,
Pin Count 16 16
Manufacturer Package Code 16LD,SOIC,JEDEC MS-012,.150" ,NARROW BODY
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e3 e0
Length 9.9 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LSSOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 5.8 ns
Propagation Delay (tpd) 7 ns 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 4.4 mm
Base Number Matches 2 1

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