74LCX157M
vs
MC74LCX258DTR2G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
ONSEMI
Part Package Code
SOIC
TSSOP-16
Package Description
SOP,
TSSOP-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e4
Length
9.9 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
7 ns
8.5 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.75 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
2.5 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
4.4 mm
Base Number Matches
6
1
Manufacturer Package Code
948F-01
HTS Code
8542.39.00.01
Factory Lead Time
2 Days
Samacsys Manufacturer
onsemi
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Output Characteristics
3-STATE
Package Equivalence Code
TSSOP16,.25
Packing Method
TR
Prop. Delay@Nom-Sup
6.5 ns
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