74LCX138MX
vs
TC74LCX138FN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
0.150 INCH, MS-012, SOIC-16
SOP, SOP16,.25
Pin Count
16
16
Manufacturer Package Code
16LD,SOIC,JEDEC MS-012,.150" ,NARROW BODY
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
6 ns
6 ns
Propagation Delay (tpd)
7.2 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
5
1
Additional Feature
2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT
Compare 74LCX138MX with alternatives
Compare TC74LCX138FN with alternatives