74LCX112M
vs
935191050118
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
SOP, SOP16,.25
SOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
J-K FLIP-FLOP
J-KBAR FLIP-FLOP
Max Frequency@Nom-Sup
150000000 Hz
Max I(ol)
0.024 A
Number of Bits
2
1
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
POSITIVE EDGE
Width
3.9 mm
3.9 mm
Base Number Matches
5
1
Pbfree Code
Yes
Part Package Code
SOIC
Pin Count
16
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
8.5 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
fmax-Min
150 MHz
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