74LCX10MTC
vs
TC74LCX02FN(EL)
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
TSSOP
SOIC
Package Description
4.40 MM, MO-153, TSSOP-14
SOP,
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
Length
5 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NOR GATE
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Functions
3
4
Number of Inputs
3
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
240
Prop. Delay@Nom-Sup
4.9 ns
Propagation Delay (tpd)
5.9 ns
5.2 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
4.4 mm
3.9 mm
Base Number Matches
3
4
Pbfree Code
Compare 74LCX10MTC with alternatives
Compare TC74LCX02FN(EL) with alternatives