74HCT7541PW-Q100J
vs
935298941118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSSOP2
Package Description
4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
TSSOP,
Pin Count
20
Manufacturer Package Code
SOT360-1
Reach Compliance Code
unknown
compliant
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
6.5 mm
6.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
48 ns
50 ns
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
2
1
Rohs Code
HTS Code
8542.39.00.01
Date Of Intro
2017-02-01
JESD-609 Code
e4
Moisture Sensitivity Level
1
Packing Method
TR, 13 INCH
Peak Reflow Temperature (Cel)
260
Terminal Finish
NICKEL PALLADIUM GOLD SILVER
Time@Peak Reflow Temperature-Max (s)
30
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