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74HCT74BQ,115 vs MC74VHCT74ADT feature comparison

74HCT74BQ,115 NXP Semiconductors

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MC74VHCT74ADT Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code QFN
Package Description 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 TSSOP, TSSOP14,.25
Pin Count 14
Manufacturer Package Code SOT762-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family HCT
JESD-30 Code R-PQCC-N14 R-PDSO-G14
JESD-609 Code e4 e0
Length 3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 18000000 Hz 65000000 Hz
Max I(ol) 0.004 A 0.008 A
Moisture Sensitivity Level 1
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Equivalence Code LCC14,.1X.12,20 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 2.5 mm
fmax-Min 18 MHz
Base Number Matches 2 5
Power Supplies 5 V
Logic » FF/Latches
Logic » FF/Latches

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