74HCT688N,652 vs CD74HCT688ME4 feature comparison

74HCT688N,652 NXP Semiconductors

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CD74HCT688ME4 Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-20 SOP, SOP20,.4
Pin Count 20 20
Manufacturer Package Code SOT146-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP Texas Instruments
Additional Feature CASCADABLE CASCADABLE
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDSO-G20
JESD-609 Code e4 e4
Length 26.73 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type IDENTITY COMPARATOR MAGNITUDE COMPARATOR
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP20,.3 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 51 ns 51 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.62 mm 7.5 mm
Base Number Matches 1 1
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method TUBE
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 42 ns

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