74HCT564D
vs
CD74HCT534M96
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
RCA SOLID STATE
Package Description
DIP, DIP20,.3
Reach Compliance Code
compliant
unknown
JESD-30 Code
R-XDIP-T20
R-PDSO-G20
JESD-609 Code
e0
e0
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Max I(ol)
0.012 A
0.006 A
Number of Functions
8
8
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP20,.3
SOP20,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
4
4
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Packing Method
TR