74HCT4067DB vs CD4067BPWE4 feature comparison

74HCT4067DB NXP Semiconductors

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CD4067BPWE4 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SSOP TSSOP
Package Description SSOP, SSOP24,.3 TSSOP, TSSOP24,.25
Pin Count 24 24
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.04 12.04
Average Weight (mg) 254 90.25
CO2e (mg) 3058.16 1086.61
Total Weight 175.4
Category CO2 Kg 12.04 12.04
CO2 2111.816
Compliance Temperature Grade Automotive: -40C to +125C Military: -55C to +125C
EU RoHS Version RoHS 2 (2015/863/EU) RoHS 2 (2011/65/EU)
Candidate List Date 2017-01-12
CAS Accounted for Wt 88
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 1309-64-4, 7440-02-0
EFUP e e
Conflict Mineral Status DRC Conflict Free DRC Conflict Free Undeterminable
Conflict Mineral Status Source CMRT V4.20 CMRT V2.03a
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e4
Length 8.2 mm 7.8 mm
Moisture Sensitivity Level 1 1
Number of Channels 16 16
Number of Functions 1 1
Number of Terminals 24 24
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 9 Ω 15 Ω
On-state Resistance-Max (Ron) 180 Ω 1050 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Equivalence Code SSOP24,.3 TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.2 mm
Signal Current-Max 0.025 A 0.025 A
Supply Current-Max (Isup) 0.08 mA 3 mA
Supply Voltage-Max (Vsup) 5.5 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Switch-off Time-Max 90 ns 440 ns
Switch-on Time-Max 98 ns 650 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 4.4 mm
Base Number Matches 2 1
parentfamilyid 892112
Samacsys Description IC MUX/DEMUX 1X16 24TSSOP
Samacsys Manufacturer Texas Instruments
Samacsys Modified On 2023-03-07 16:10:32

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