74HCT4066NB
vs
CD54HCT4066F3A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.025 mm
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
14
14
Off-state Isolation-Nom
50 dB
On-state Resistance Match-Nom
5 Ω
On-state Resistance-Max (Ron)
95 Ω
142 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Current-Max (Isup)
0.04 mA
0.16 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Switch-off Time-Max
35 ns
Switch-on Time-Max
24 ns
24 ns
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Normal Position
NO
Output
SEPARATE OUTPUT
Package Equivalence Code
DIP14,.3
Switching
MAKE-BEFORE-BREAK
Terminal Finish
TIN LEAD
Compare 74HCT4066NB with alternatives
Compare CD54HCT4066F3A with alternatives