74HCT3G34DP vs NC7WP32L8X feature comparison

74HCT3G34DP NXP Semiconductors

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NC7WP32L8X Fairchild Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC MICROPAK MLP
Package Description 3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT P
JESD-30 Code S-PDSO-G8 S-XQCC-N8
JESD-609 Code e4 e4
Length 3 mm 1.6 mm
Logic IC Type BUFFER OR GATE
Moisture Sensitivity Level 1 1
Number of Functions 3 2
Number of Inputs 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP VQCCN
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 29 ns 43 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.55 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 0.9 V
Supply Voltage-Nom (Vsup) 5 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD NICKEL GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3 mm 1.6 mm
Base Number Matches 3 1
Manufacturer Package Code 8LD,MICROPAK, JEDEC MO-255, VARIATION UAAD, 1.6MM SQUARE
ECCN Code EAR99
Load Capacitance (CL) 30 pF
Max I(ol) 0.0005 A
Package Equivalence Code LCC8,.06SQ,20
Packing Method TR
Prop. Delay@Nom-Sup 43 ns
Schmitt Trigger NO

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