74HCT3G34DP vs 74AHC2G08DP feature comparison

74HCT3G34DP NXP Semiconductors

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74AHC2G08DP NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description 3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8 3 MM, PLASTIC, SOT505-2, TSSOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT AHC/VHC/H/U/V
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e4 e4
Length 3 mm 3 mm
Logic IC Type BUFFER AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 3 2
Number of Inputs 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 29 ns 16 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3 mm 3 mm
Base Number Matches 3 6
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Package Equivalence Code TSSOP8,.16
Packing Method TR
Prop. Delay@Nom-Sup 10.5 ns
Schmitt Trigger NO

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Compare 74AHC2G08DP with alternatives