74HCT3G34DC
vs
NC7WZ32L8X
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
Part Package Code |
TSSOP
|
UQFN-8
|
Package Description |
VSSOP,
|
MICROPAK-8
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HCT
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G8
|
S-XQCC-N8
|
JESD-609 Code |
e4
|
e4
|
Length |
2.3 mm
|
1.6 mm
|
Logic IC Type |
BUFFER
|
OR GATE
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
3
|
2
|
Number of Inputs |
1
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
VSSOP
|
VQCCN
|
Package Equivalence Code |
TSSOP8,.12,20
|
LCC8,.06SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
29 ns
|
11 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.55 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
1.6 mm
|
Base Number Matches |
3
|
2
|
Manufacturer Package Code |
|
523AY
|
Factory Lead Time |
|
2 Days
|
Samacsys Manufacturer |
|
onsemi
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
5.2 ns
|
Schmitt Trigger |
|
NO
|
|
|
|
Compare 74HCT3G34DC with alternatives