74HCT3G34DC vs NC7WZ32L8X feature comparison

74HCT3G34DC NXP Semiconductors

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NC7WZ32L8X onsemi

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Pbfree Code Yes Yes
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code TSSOP UQFN-8
Package Description VSSOP, MICROPAK-8
Pin Count 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT LVC/LCX/Z
JESD-30 Code R-PDSO-G8 S-XQCC-N8
JESD-609 Code e4 e4
Length 2.3 mm 1.6 mm
Logic IC Type BUFFER OR GATE
Moisture Sensitivity Level 1 1
Number of Functions 3 2
Number of Inputs 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VSSOP VQCCN
Package Equivalence Code TSSOP8,.12,20 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 29 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.55 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1.6 mm
Base Number Matches 3 2
Manufacturer Package Code 523AY
Factory Lead Time 2 Days
Samacsys Manufacturer onsemi
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Packing Method TR
Prop. Delay@Nom-Sup 5.2 ns
Schmitt Trigger NO

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