74HCT3G14DP,125 vs 74HCT3G14DP feature comparison

74HCT3G14DP,125 NXP Semiconductors

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74HCT3G14DP Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP
Package Description 3 MM, PLASTIC, SOT-505-2, TSSOP-8 TSSOP,
Pin Count 8
Manufacturer Package Code SOT505-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e4 e4
Length 3 mm 3 mm
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER INVERTER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP8,.16
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 48 ns
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD SILVER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3 mm 3 mm
Base Number Matches 2 3
Date Of Intro 2017-02-01

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Compare 74HCT3G14DP with alternatives