74HCT373PW,112
vs
SN74LS373JDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
TSSOP2
Package Description
4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
DIP, DIP20,.3
Pin Count
20
Manufacturer Package Code
SOT360-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HCT
LS
JESD-30 Code
R-PDSO-G20
R-CDIP-T20
JESD-609 Code
e4
e0
Length
6.5 mm
24.515 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP20,.25
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
45 ns
Propagation Delay (tpd)
48 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
7.62 mm
Base Number Matches
1
1
Compare 74HCT373PW,112 with alternatives
Compare SN74LS373JDS with alternatives