74HCT373PW,112 vs SN74LS373JD feature comparison

74HCT373PW,112 NXP Semiconductors

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SN74LS373JD Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code TSSOP2 DIP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 DIP, DIP20,.3
Pin Count 20 20
Manufacturer Package Code SOT360-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT LS
JESD-30 Code R-PDSO-G20 R-CDIP-T20
JESD-609 Code e4 e0
Length 6.5 mm 24.515 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSSOP DIP
Package Equivalence Code TSSOP20,.25 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 48 ns 30 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 7.62 mm
Base Number Matches 1 2

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