74HCT373N,652 vs MC74HCT373AND feature comparison

74HCT373N,652 NXP Semiconductors

Buy Now Datasheet

MC74HCT373AND Motorola Mobility LLC

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, MS-001, SC-603, SOT-146-1, DIP-20 DIP,
Pin Count 20 20
Manufacturer Package Code SOT146-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e4 e0
Length 26.73 mm 26.415 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method BULK
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Pbfree Code No

Compare 74HCT373N,652 with alternatives

Compare MC74HCT373AND with alternatives