74HCT367DB,118
vs
74HCT367D,653
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SSOP1
|
SOP
|
Package Description |
SSOP,
|
PLASTIC, SO-16
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
SOT338-1
|
SOT109-1
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ONE FUNCTION WITH TWO BITS
|
ONE FUNCTION WITH TWO BITS
|
Family |
HCT
|
HCT
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e4
|
Length |
6.2 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
6
|
6
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Propagation Delay (tpd) |
38 ns
|
38 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
5.3 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare 74HCT367DB,118 with alternatives
Compare 74HCT367D,653 with alternatives