74HCT366D vs CD74HCT366M96 feature comparison

74HCT366D NXP Semiconductors

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CD74HCT366M96 Intersil Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
Pin Count 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW ENABLE LOW
Family HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Moisture Sensitivity Level 1
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 36 ns 33 ns
Propagation Delay (tpd) 36 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 3 3
Packing Method TR

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