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74HCT2G02DP vs 74HCT2G02DC,125 feature comparison

74HCT2G02DP Philips Semiconductors

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74HCT2G02DC,125 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP, TSSOP8,.16 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSSOP
Package Equivalence Code TSSOP8,.16 TSSOP8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 29 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.5 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code SSOP
Pin Count 8
Manufacturer Package Code SOT765-1
Factory Lead Time 4 Weeks
Family HCT
Length 2.3 mm
Moisture Sensitivity Level 1
Number of Functions 2
Number of Inputs 2
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 29 ns
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 30
Width 2 mm
Logic » Gates
Logic » Gates

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