74HCT273NB
vs
MM54HCT273J/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIP, DIP20,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12
12
Average Weight (mg)
4319.45
4319.45
CO2e (mg)
51833.402
51833.402
Category CO2 Kg
12
12
Compliance Temperature Grade
Automotive: -40C to +125C
Military: -55C to +125C
Family
HCT
JESD-30 Code
R-PDIP-T20
R-XDIP-T20
Length
26.73 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
8
Number of Functions
1
8
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
20 MHz
Base Number Matches
1
3
Rohs Code
Candidate List Date
2011-06-20
JESD-609 Code
e0
Max I(ol)
0.004 A
Package Equivalence Code
DIP20,.3
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Compare 74HCT273NB with alternatives
Compare MM54HCT273J/883 with alternatives