74HCT273NB vs GD74HCT273J feature comparison

74HCT273NB NXP Semiconductors

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GD74HCT273J LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS LG SEMICON CO LTD
Part Package Code DIP
Package Description DIP, DIP, DIP20,.3
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-PDIP-T20 R-XDIP-T20
Length 26.73 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
fmax-Min 20 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Max Frequency@Nom-Sup 22000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code DIP20,.3
Terminal Finish Tin/Lead (Sn/Pb)

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