74HCT273BQ,115
vs
TC74HCT273AF-EL
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
HVQCCN,
|
SOP,
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
SOT764-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HCT
|
HCT
|
| JESD-30 Code |
R-PQCC-N20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4.5 mm
|
12.8 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
45 ns
|
38 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.8 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
2.5 mm
|
5.3 mm
|
| fmax-Min |
20 MHz
|
24 MHz
|
| Base Number Matches |
2
|
1
|
| Load Capacitance (CL) |
|
50 pF
|
| Package Equivalence Code |
|
SOP20,.3
|
|
|
|
Compare 74HCT273BQ,115 with alternatives
Compare TC74HCT273AF-EL with alternatives