74HCT259D,652 vs 74HCT259D-T feature comparison

74HCT259D,652 NXP Semiconductors

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74HCT259D-T NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOP SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT-109, SOP-16 SOP, SOP16,.25
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Max I(ol) 0.004 A 0.00002 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 59 ns 59 ns
Propagation Delay (tpd) 59 ns 57 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type LOW LEVEL LOW LEVEL
Width 3.9 mm 3.9 mm
fmax-Min 60 MHz 60 MHz
Base Number Matches 2 3
Packing Method TR

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