74HCT251PW vs TC74HC257AF(TP1) feature comparison

74HCT251PW Nexperia

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TC74HC257AF(TP1) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer NEXPERIA TOSHIBA CORP
Package Description TSSOP, 0.300 INCH, PLASTIC, SOP-16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Date Of Intro 1995-11-01
Family HCT HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 5 mm 10.3 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 66 ns 35 ns
Seated Height-Max 1.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 4.4 mm 5.3 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code SOIC
Pin Count 16
Load Capacitance (CL) 150 pF
Qualification Status Not Qualified

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Compare TC74HC257AF(TP1) with alternatives