74HCT251DB,112 vs JM38510/30903BFA feature comparison

74HCT251DB,112 NXP Semiconductors

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JM38510/30903BFA Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SSOP1 DFP
Package Description SOT-338-1, SSOP-16 DFP,
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT LS
JESD-30 Code R-PDSO-G16 R-GDFP-F16
JESD-609 Code e4
Length 6.2 mm 9.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DFP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH FLATPACK
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 53 ns
Propagation Delay (tpd) 66 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.15 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING FLAT
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 6.415 mm
Base Number Matches 2 3

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