74HCT238N vs CD74HCT238EX feature comparison

74HCT238N Philips Semiconductors

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CD74HCT238EX Intersil Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS INTERSIL CORP
Package Description DIP-16 DIP, DIP16,.3
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 50 ns 53 ns
Qualification Status Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
Family HCT
Input Conditioning STANDARD
JESD-609 Code e0
Output Polarity TRUE
Propagation Delay (tpd) 44 ns
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Terminal Finish Tin/Lead (Sn/Pb)