74HCT175PW,112
vs
CD54HCT175H/3A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
DIE,
Pin Count
16
Manufacturer Package Code
SOT403-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HCT
HCT
JESD-30 Code
R-PDSO-G16
X-XUUC-N16
JESD-609 Code
e4
Length
5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
17000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Equivalence Code
TSSOP16,.25
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Packing Method
BULK
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
50 ns
50 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
4.4 mm
fmax-Min
17 MHz
25 MHz
Base Number Matches
2
2
Compare 74HCT175PW,112 with alternatives
Compare CD54HCT175H/3A with alternatives