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74HCT175DB vs 74HCT175DB,112 feature comparison

74HCT175DB Nexperia

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74HCT175DB,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description SSOP, SSOP, SSOP16,.3
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-01
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1 1
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 50 ns 50 ns
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 17 MHz 17 MHz
Base Number Matches 2 2
Part Package Code SSOP1
Pin Count 16
Manufacturer Package Code SOT338-1
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 17000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code SSOP16,.3
Packing Method BULK
Qualification Status Not Qualified
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HCT175DB,112 with alternatives