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74HCT175D,652 vs DV74HCT175N feature comparison

74HCT175D,652 NXP Semiconductors

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DV74HCT175N avg Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS AVG SEMICONDUCTORS
Part Package Code SOP DIP
Package Description 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16 DIP,
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4
Length 9.9 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 17000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 50 ns 50 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.44 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 7.62 mm
fmax-Min 17 MHz 17 MHz
Base Number Matches 1 1
Logic » FF/Latches
Logic » FF/Latches

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