74HCT174DB,112 vs TC74HCT174AF feature comparison

74HCT174DB,112 NXP Semiconductors

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TC74HCT174AF Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SSOP1 SOIC
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz 24000000 Hz
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Bits 6 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method BULK TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 53 ns 43 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 20 MHz 61 MHz
Base Number Matches 2 1
Pbfree Code Yes
Package Description SOP, SOP16,.3

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