74HCT174DB,112
vs
TC74HCT174AF
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TOSHIBA CORP
Part Package Code
SSOP1
SOIC
Pin Count
16
16
Manufacturer Package Code
SOT338-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HCT
HCT
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e0
Length
6.2 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
24000000 Hz
Max I(ol)
0.004 A
0.004 A
Moisture Sensitivity Level
1
Number of Bits
6
6
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Equivalence Code
SSOP16,.3
SOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Packing Method
BULK
TUBE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
53 ns
43 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
5.3 mm
fmax-Min
20 MHz
61 MHz
Base Number Matches
2
1
Pbfree Code
Yes
Package Description
SOP, SOP16,.3
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