74HCT174DB,112 vs M74HCT174TTR feature comparison

74HCT174DB,112 NXP Semiconductors

Buy Now Datasheet

M74HCT174TTR STMicroelectronics

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code SSOP1 TSSOP
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 6.2 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Bits 6 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Equivalence Code SSOP16,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method BULK TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 53 ns 35 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 4.4 mm
fmax-Min 20 MHz 24 MHz
Base Number Matches 2 1
Package Description TSSOP, TSSOP16,.25

Compare 74HCT174DB,112 with alternatives

Compare M74HCT174TTR with alternatives