74HCT173DB,112
vs
HD74LS375RP-EL
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HITACHI LTD
|
| Part Package Code |
SSOP1
|
SOIC
|
| Package Description |
SOT-338-1, SSOP-16
|
SOP,
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT338-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH HOLD MODE
|
|
| Family |
HCT
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
6.2 mm
|
9.9 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
2
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
60 ns
|
27 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
HIGH LEVEL
|
| Width |
5.3 mm
|
3.95 mm
|
| fmax-Min |
60 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
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