74HCT165D-Q100
vs
74HCT165PW-Q100
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
|
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
HCT
|
HCT
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
9.9 mm
|
5 mm
|
| Logic IC Type |
PARALLEL IN SERIAL OUT
|
PARALLEL IN SERIAL OUT
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
51 ns
|
51 ns
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
3.9 mm
|
4.4 mm
|
| fmax-Min |
17 MHz
|
17 MHz
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 74HCT165D-Q100 with alternatives