74HCT154PW,112 vs CD74HCT4515M96 feature comparison

74HCT154PW,112 NXP Semiconductors

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CD74HCT4515M96 Intersil Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code TSSOP2
Package Description 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24 SOP, SOP24,.4
Pin Count 24
Manufacturer Package Code SOT355-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 2 ENABLE INPUTS
Family HCT HCT
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e0
Length 7.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP24,.25 SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 53 ns 69 ns
Propagation Delay (tpd) 53 ns 69 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 2 3
ECCN Code EAR99
Packing Method TR

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