74HCT154PW,112
vs
N82S50A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
SIGNETICS CORP
|
| Part Package Code |
TSSOP2
|
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
|
,
|
| Pin Count |
24
|
|
| Manufacturer Package Code |
SOT355-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
1995-11-01
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Additional Feature |
2 ENABLE INPUTS
|
|
| Family |
HCT
|
S
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T14
|
| JESD-609 Code |
e4
|
|
| Length |
7.8 mm
|
|
| Load Capacitance (CL) |
50 pF
|
15 pF
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
DECIMAL DECODER/DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
14
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
53 ns
|
16 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 74HCT154PW,112 with alternatives
Compare N82S50A with alternatives