74HCT138D,652
vs
MC74HCT138AN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
SOP
DIP
Package Description
3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
DIP,
Pin Count
16
16
Manufacturer Package Code
SOT109-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Additional Feature
3 ENABLE INPUTS
3 ENABLE INPUTS
Family
HCT
HCT
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e4
e0
Length
9.9 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
OTHER DECODER/DRIVER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
53 ns
Propagation Delay (tpd)
53 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.44 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
Compare 74HCT138D,652 with alternatives
Compare MC74HCT138AN with alternatives