74HCT132N,652
vs
MC74HCT00AN
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP14,.3
|
DIP,
|
Pin Count |
14
|
14
|
Manufacturer Package Code |
SOT27-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Family |
HCT
|
HCT
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
JESD-609 Code |
e4
|
e0
|
Length |
19.025 mm
|
18.86 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Packing Method |
BULK
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
41 ns
|
|
Propagation Delay (tpd) |
50 ns
|
28 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
YES
|
|
Seated Height-Max |
4.2 mm
|
4.69 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare 74HCT132N,652 with alternatives
Compare MC74HCT00AN with alternatives