74HCT10DB,118
vs
74HCT10D
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
SSOP1
Package Description
SSOP,
Pin Count
14
Manufacturer Package Code
SOT337-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Moisture Sensitivity Level
1
Number of Functions
3
Number of Inputs
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
36 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
Base Number Matches
2
3
Max I(ol)
0.004 A
Package Equivalence Code
SOP14,.25
Prop. Delay@Nom-Sup
30 ns
Schmitt Trigger
NO
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