74HCT10D,653
vs
SN74LV00ADBRG4
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
SSOP
|
| Package Description |
SO-14
|
SSOP-14
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
SOT108-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
HCT
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
8.65 mm
|
6.2 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
3
|
4
|
| Number of Inputs |
3
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
36 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL/PALLADIUM/GOLD (NI/PD/AU)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
5.3 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.006 A
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
SSOP14,.3
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
13 ns
|
| Schmitt Trigger |
|
NO
|
|
|
|
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