74HCT08D,652
vs
TC74HCT08AFN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
3.90 MM, PLASTIC, MO-012, SOT-108-1, SO-14
SOP, SOP14,.25
Pin Count
14
14
Manufacturer Package Code
SOT108-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.0052 A
0.004 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
36 ns
25 ns
Propagation Delay (tpd)
36 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
2
1
Pbfree Code
Additional Feature
NOT AVAILABLE IN JAPAN
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