74HCT03PW-Q100J
vs
74HCT03PW,118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
SOT-402-1, TSSOP-14
Pin Count
14
14
Manufacturer Package Code
SOT402-1
SOT402-1
Reach Compliance Code
unknown
compliant
Family
HCT
HCT
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
5 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
36 ns
36 ns
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
2
2
Rohs Code
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP14,.25
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
29 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
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