74HC75U vs MC74HC175N feature comparison

74HC75U NXP Semiconductors

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MC74HC175N Rochester Electronics LLC

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIE DIP
Package Description DIE, PLASTIC, DIP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-XUUC-N R-PDIP-T16
Logic IC Type D LATCH D FLIP-FLOP
Number of Bits 2 4
Number of Functions 2 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 190 ns 45 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Trigger Type HIGH LEVEL POSITIVE EDGE
Base Number Matches 1 3
Pbfree Code No
Rohs Code No
Pin Count 16
JESD-609 Code e0
Length 19.175 mm
Number of Terminals 16
Seated Height-Max 4.44 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm
fmax-Min 20 MHz

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