74HC74PW
vs
MC74F74DD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
MOTOROLA INC
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
3
2
Part Package Code
SOIC
Package Description
SOP,
Pin Count
14
Family
F/FAST
Length
8.65 mm
Number of Bits
1
Output Polarity
COMPLEMENTARY
Power Supply Current-Max (ICC)
16 mA
Propagation Delay (tpd)
9.2 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Width
3.9 mm
fmax-Min
100 MHz
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