74HC74PW
vs
MC54HC107JD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-GDIP-T14
JESD-609 Code
e4
e0
Length
5 mm
19.495 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
J-K FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Bits
1
2
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP14,.25
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
265 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
NEGATIVE EDGE
Width
4.4 mm
7.62 mm
fmax-Min
24 MHz
20 MHz
Base Number Matches
3
3
Compare 74HC74PW with alternatives
Compare MC54HC107JD with alternatives