74HC74BQ,115
vs
MM54HC74AW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
QFN
Package Description
HVQCCN, LCC14,.1X.12,20
DFP, FL14,.3
Pin Count
14
Manufacturer Package Code
SOT762-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PQCC-N14
R-GDFP-F14
JESD-609 Code
e4
e0
Length
3 mm
9.614 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
HVQCCN
DFP
Package Equivalence Code
LCC14,.1X.12,20
FL14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
265 ns
33 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
2.032 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
NO LEAD
FLAT
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
2.5 mm
6.35 mm
fmax-Min
24 MHz
20 MHz
Base Number Matches
2
2
Compare 74HC74BQ,115 with alternatives
Compare MM54HC74AW with alternatives