74HC73DB-T vs 54AC74DM feature comparison

74HC73DB-T NXP Semiconductors

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54AC74DM National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code SSOP
Package Description SSOP, SSOP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MASTER SLAVE OPERATION
Family HC/UH AC
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 6.2 mm 19.939 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz 70000000 Hz
Max I(ol) 0.004 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 2 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 240 ns 17.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 5.3 mm 7.62 mm
fmax-Min 24 MHz 95 MHz
Base Number Matches 1 2
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 17.5 ns
Total Dose 300k Rad(Si) V

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